Assembly Package Engineer


Boston, MA, US
  • Job Type: Full-Time
  • Function: Engineering Hardware
  • Industry: Technology
  • Post Date: 05/12/2022
  • Email:
  • Website:
  • Company Address: 77 Summer Street, Floor 8, Boston, Massachusetts 02110, US

About Vesper

At Vesper, our mission is to deliver voice-powered products to every market, around the world. Our revolutionary piezoelectric mems microphone technology ensures our microphones are immune to dust, water, solder flux vapors and other similar environmental contaminants. As if that weren’t enough, our game-changing zero-power listening technology enables end consumers to have battery-powered devices that can always respond to them.

Job Description



Vesper is the leader in the high growth MEMS microphone market. Using our cutting-edge proprietary piezoelectric MEMS technology, we have pioneered a new class of voice interface devices. Located in downtown Boston, Vesper has established a world class engineering team to advance piezoelectric technology development.  Designing; Microelectromechanical Systems (MEMS), Application Specific Integrated Circuits (ASICs) and packaging technologies, Vesper is helping to enable new capabilities for our customers.   Come join Vesper.




  • Work with Semiconductor Assembly Sub-Contract Organizations for technical issues.
  • Design and Manage Engineering Runs through Sub-Contract Assembly Manufacturers.
  • Work with product development teams to translate new product specifications into manufacturable package design.
  • Develop and improve methods to measure and evaluate package processes and features through modeling and simulations.
  • Apply statistical process control (SPC) methodologies to monitor and improve production processes.
  • Optimize package processes for quality and yield
  • Contribute to the innovation of advanced package solutions, new material development, and specs.
  • Provide guidance to manufacturing line in trouble shooting issues.




  • BS degree in Engineering or Science. MS preferred.
  • 3 to 15 years of work experience in semiconductor manufacturing
  • Familiar with assembly and packaging processes e.g, Molding, Metallization, Bumping/Wire-bonding, Wafer/Die Dicing and Laminate, a plus.
  • Good understanding of packaging materials, reliability standards, FA techniques, etc. a plus.
  • Some understanding of modeling of stress, strain, and electrical properties of various package types using FEA and other techniques a plus.
  • Basic understanding of Design for Manufacturability and requirements needed to ramp technologies in a high-volume manufacturing environment a plus.
  • Worked with Assembly Subcontract manufactures and able to manage engineering and quality aspects of assembly through the subcontractor.
  • Strong written and spoken communication skills.
  • Ability to creatively solve problems in a fast-paced product development environment
  • Ability to work & effectively interact (remotely, as needed) with sub-contractors

Candidates must be authorized to work in the United States

Wage: Vesper offers a competitive salary and attractive stock option package


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